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Heat Staking Plastic Assembly

CullDez Product Development   Site Map
Winter 2009
Brentwood, California

Designers & Engineers Developing Products
Consistently Exceeding Our Customer's Needs
Semi-Conductor Capital Equipment
Project: Bread Box

Design Challenge: To develop a 150/200 millimeter "Bread Box" to fit a semi standard 300 millimeter load part. It was to be designed with a tilt and dampening mechanism while not incurring any wafer damage. This company faced "Project Overload" and needed a product development company to step in and quickly absorb the design criteria. This needed to be done with minimal support from the inside engineering group.
The Result: A well maintained budget and timeline ultimately delivering a well designed product.